375124B60024G by Boyd Corporation

Overview of 375124B60024G by Boyd Corporation

The 375124B60024G is an aluminum, anodized, pin fin array heat sink designed by Boyd Corporation for optimal thermal management. This component measures 40 mm in length and width and has a height of 25 mm. Its unique pin fin design, which is omnidirectional, allows for better heat dissipation compared to traditional fin orientations. The anodized finish not only enhances the heat sink’s thermal conductivity but also protects against corrosion. It is designed primarily to handle heat dissipation for component packages like BGA (Ball Grid Array) and FPGA (Field-Programmable Gate Array), making it a crucial component for managing device temperature. Fully compliant with ROHS and REACH regulations, this heat sink combines environmental safety with high performance, ensuring adherence to current global standards.

Industry Applications for 375124B60024G

The Boyd Corporation’s 375124B60024G heat sink can be applicable in several industries, providing benefits for various applications due to its thermal management features. Here are some potential industries and applications:

  • Consumer Electronics: Devices like high-performance gaming consoles and laptops, which require efficient cooling for their CPUs and GPUs, could potentially use the 375124B60024G to improve heat dissipation.
  • Industrial Automation: Automation equipment such as PLCs and motor drives often deal with thermal management issues. The Boyd Corporation’s heat sink might be used in these devices to potentially help mitigate heat build-up and improve reliability.
  • Audio and Video Systems: Modern audio amplifiers and broadcast equipment, which can generate significant amounts of heat due to their high power and performance, might utilize such heat sinks to possibly extend their operational lifespan.
  • Entertainment and Gaming: Arcade systems and virtual reality hardware, which require extensive graphical processing units, might benefit from the addition of robust thermal solutions like the 375124B60024G.

Note: These potential industry applications are illustrative and any such applications would require analysis and verification by engineering and design teams for adherence to industry standards and specific application requirements.

About Boyd Corporation

Boyd Corporation is a leader in thermal management and environmental sealing solutions, providing high-performance Heat Sinks such as the 375124B60024G and other related products. The company specializes in developing custom engineered solutions that are critical for the protection of electronics and electrical components across various industries. With a focus on innovation and quality, Boyd Corporation continues to advance its technologies, expanding its product offerings to meet the evolving needs of its customers. Their expertise in aluminum heat sinks and the pin fin array technology positions them as a significant player in the realm of thermal management solutions.

Where to Find 375124B60024G by Boyd Corporation

To procure the 375124B60024G, a potential buyer could research and compare availability on findchips.com. This site allows users to check real-time stock levels and pricing from various distributors. Historically, this part has been available from distributors like Avnet Abacus, TME, and RS. While visiting findchips.com, users can also utilize the search to find alternate parts to the 375124B60024G that might be offered by Boyd Corporation or other manufacturers, through this link – Heat Sinks.

Compare pricing for 375124B60024G and other Heat Sinks / Thermal Support Devices at findchips.com