507302B00000G by BOYD Laconia

Overview of 507302B00000G by BOYD Laconia

The 507302B00000G is a heat sink designed to provide efficient thermal management for electronic components, specifically transistors. This component features a low-profile design, suitable for applications requiring compact assemblies where space is a premium. The part is constructed from anodized aluminum, which enhances heat dissipation while minimizing weight. The heat sink has a transverse fin orientation, allowing for optimal airflow and thermal transfer.

In terms of thermal performance, the 507302B00000G offers a thermal resistance rating of 24 °C/W, indicating its ability to effectively manage heat generated by a TO-220 package transistor with a power rating of 2.5W. This makes it suitable for various applications where heat buildup could potentially impact the performance or lifespan of the components being cooled. The black finish not only contributes to an aesthetically pleasing appearance but also aids in enhanced thermal dissipation.

This part complies with RoHS standards and is lead-free, making it a suitable choice for environmentally-conscious designs. The current factory lead time is approximately 8 weeks, which is important to consider when planning procurement and production schedules.

Industry Applications for 507302B00000G

The 507302B00000G could potentially be utilized in various industry applications due to its versatile nature and effective thermal management properties. Below are some illustrative examples of industries that might benefit from this heat sink:

  • Consumer Electronics: The heat sink might be employed in devices such as mobile phones, tablets, or laptops where compactness and efficient cooling are essential. Its low profile could fit well into space-constrained designs.
  • Industrial Automation: In control systems or robotic applications, the 507302B00000G could possibly be integrated with control chips or sensors, aiding in managing heat during operation, which could enhance reliability and efficiency.
  • Telecommunications: Equipment such as base stations or networking hardware might utilize this heat sink to ensure reliable operation under continuous load, thus potentially increasing system longevity and stability.
  • Aerospace and Defense: In rugged environments, the part might find use in avionics or control systems where thermal management is critical for performance. However, this application should be carefully evaluated for compliance with specific military standards.
  • Medical Imaging: In devices such as ultrasound machines or MRI systems, efficient thermal management is crucial. The 507302B00000G could potentially assist in reducing overheating risks, thereby promoting consistent image quality.

It is important to note that these potential industry applications are only conceptual and illustrative. A thorough analysis and verification by engineering and design teams are essential to ensure adherence to industry standards and specific application requirements.

About BOYD Laconia

BOYD Laconia specializes in manufacturing thermal management solutions, particularly in the realm of heat sinks and thermal support devices. The company is known for its commitment to providing products that enhance thermal efficiency in a range of applications. The 507302B00000G exemplifies their approach to creating high-performance, reliable thermal devices.

In addition to the 507302B00000G, BOYD Laconia manufactures a variety of other heat sinks optimized for different configurations and performance needs. Their portfolio includes options designed for various thermal resistance specifications and form factors, catering to diverse market demands. The quality assurance processes they implement ensure that parts like the 507302B00000G meet industry standards for performance and safety.

Research Price and Stock for 507302B00000G by BOYD Laconia on Findchips.com

507302B00000G, it is advisable to research current stock and pricing information at Findchips. This platform not only provides real-time stock levels but also includes pricing trends for the part and similar heat sinks categorized under Heat Sinks.

The 507302B00000G has been historically available at various distributors, including:

  • New Advantage Corporation
  • Master Electronics
  • Sager
  • Bristol Electronics
  • Bisco Industries
  • Quest Components
  • Verical
  • Onlinecomponents.com
  • Mouser Electronics
  • DigiKey

However, it is important to verify the current stock levels and pricing for the part through Findchips, as availability may vary across distributors.

Compare pricing for 507302B00000G and other Heat Sinks / Thermal Support Devices at findchips.com