529802B02500G by Boyd Corporation

Overview of 529802B02500G by Boyd Corporation

The 529802B02500G is a passive Heat Sink designed for efficient thermal management in electronic assemblies. Manufactured by Boyd Corporation, this part specifically caters to devices like To-220 packages, making it suitable for high-power transistor applications including voltage regulators, amplifiers, and power switches. Characterized by an extruded aluminum construction with a black anodized finish, the heat sink guarantees both durability and effective heat dissipation.

Measuring 38.1mm in height, 25.4mm in width, and 41.91mm in length, the 529802B02500G offers a thermal resistance of 3.7°C/W. Its radial fin orientation enhances the air flow, thus improving the thermal management performance. The heat sink’s design and materials are compliant with major environmental standards such as RoHS and REACH, reflecting Boyd Corporation’s commitment to environmental sustainability. With an active part life cycle status, this component ensures availability and support for ongoing and new designs.

Industry Applications for 529802B02500G

The 529802B02500G could potentially be utilized in a variety of industry applications. Given its role in dissipating heat from packed and high-performance electronic components, the industries which might benefit from this particular heat sink include:

  • Industrial Automation: The reliability and efficiency of heat sinks like the 529802B02500G may be critical in managing the thermal profile of machinery controls and automation systems where operational uptime is crucial. The use of such heat sinks potentially contributes to the longevity and safety of equipment in these settings.
  • Electronic Manufacturing: Companies dealing with the production of electronic devices, especially those involving power-intensive processes, could find an application for a device like the 529802B02500G. For instance, this could include power supplies and converters which often require effective thermal management solutions to ensure stability and performance during prolonged periods of operation.

It is important to bear in mind that these potential industry applications are purely illustrative and need careful analysis and confirmation by engineering teams to ensure compliance with specific industry standards and application requirements.

About Boyd Corporation

Boyd Corporation is a leader in thermal management and environmental sealing, which makes them particularly proficient in the creation of Heat Sinks and associated thermal support devices. Their expertise extends across a range of applications from automotive to electronics, ensuring high performance and reliability of parts like the 529802B02500G. Boyd’s solutions are designed to meet stringent industry standards, and their products are a testament to a commitment towards advanced engineering and sustainability.

Where to Find 529802B02500G by Boyd Corporation

To source the 529802B02500G, potential buyers should consider researching on platforms like findchips.com, where they can access comprehensive information about stock levels and current pricing from different distributors. Historically, the product has been available from distributors such as Avnet Abacus, TME, RS, Avnet Americas, and Newark. However, availability can fluctuate, making it essential to check updated information on findchips.com.

To compare alternatives to 529802B02500G, or explore other products by Boyd Corporation and different manufacturers, accessing the information on Heat Sinks through the provided link can be valuable. This will enable buyers to make informed decisions based on current market trends and product availability.

Compare pricing for 529802B02500G and other Heat Sinks / Thermal Support Devices at findchips.com