Overview of 529802B02500G by BOYD Laconia
The 529802B02500G is an extruded heat sink designed for TO-220 packages, specifically engineered to facilitate optimal thermal management. Constructed from anodized aluminum, this component exhibits a thermal resistance of 3.7 degrees Celsius per watt, making it suitable for applications where efficient heat dissipation is crucial. The heat sink measures 38.1mm in height, 41.91mm in length, and 25.4mm in width, providing ample surface area for heat exchange. It incorporates radial fin orientation, enhancing airflow around the component and improving thermal performance.
The part is RoHS compliant, ensuring it meets environmental standards concerning hazardous substances. With a body material of aluminum and a black anodized finish, it not only provides functional utility but also contributes to aesthetic integration within electronic assemblies. As of the current writing, the factory lead time for acquiring this component is reported to be around six weeks.
Industry Applications for 529802B02500G
The 529802B02500G heat sink could potentially find applications across various industries that require effective thermal management solutions. Below are some illustrative examples of how this part might be used:
- Automotive: In automotive electronics, the 529802B02500G could be utilized in power electronics modules where thermal regulation is essential. Components such as motor controllers or battery management systems might utilize heat sinks to maintain temperature within operational limits.
- Consumer Electronics: In consumer electronics, devices such as amplifiers or LED drivers could potentially benefit from the thermal properties of this heat sink. The anodized aluminum construction provides a lightweight yet robust solution for heat dissipation.
- Industrial Automation: Equipment utilized in industrial automation could use the 529802B02500G to manage heat produced by control circuits or motors. This heat sink might assist in ensuring reliability and longevity of components facing high thermal loads.
- Telecommunications: In telecommunications devices, the heat sink could be employed in RF amplifiers where high power levels generate significant heat. By maintaining optimal thermal conditions, it might enhance performance and device reliability.
- Aerospace and Defense: Components in aerospace systems could potentially utilize this heat sink for managing thermal loads in avionics or sensor systems. The need for compliant materials in this sector makes the RoHS compliant nature of this part advantageous.
These potential industry applications are only conceptual and illustrative, requiring thorough analysis and verification by engineering and design teams to ensure adherence to specific industry standards and requirements.
About BOYD Laconia
BOYD Laconia specializes in the production of thermal management solutions, particularly in the heat sinks segment within the broader category of thermal support devices. The company focuses on providing quality products that efficiently dissipate heat, thereby enhancing the performance and reliability of electronic systems.
The 529802B02500G is among various heat sink options manufactured by BOYD Laconia. Their portfolio includes alternatives that may be suited for different thermal management needs, all designed to meet rigorous thermal performance metrics and compliance standards.
Research Price and Stock for 529802B02500G by BOYD Laconia on Findchips.com
For those interested in acquiring the 529802B02500G, it is recommended to research stock levels and pricing through Findchips. This platform can provide insights into availability and cost from various distributors. The part has historically been available at distributors such as Master Electronics, Sager, Mouser Electronics, and DigiKey, among others. However, it is crucial to check current stock levels as availability may vary.
Additionally, the Heat Sinks category on Findchips allows users to explore alternative thermal management solutions that might be offered by BOYD Laconia or other manufacturers, providing a broader selection for your thermal management needs.