Overview of 551002B00000G by Boyd Corporation
The 551002B00000G is a heat sink designed specifically for thermal management applications involving high power transistors, notably the TO-220 package type. This model showcases a U-profile with a folded-back fin design, constructed from aluminum and finished with an anodizing process for improve thermal efficiency and environmental resistance. The part offers a thermal resistance of 12.4°C/W, highlighting its capability to efficiently dissipate heat to maintain optimal operating temperatures for the electronic components it cools.
The dimensions of the heat sink include a length of 36.83mm, a height of 19.99mm, and a width of 25.55mm. Compliant with RoHS and REACH directives, the 551002B00000G adheres to strict ecological and safety standards, making it suitable for use in a wide range of markets and geographical regions. Notably, the current factory lead time for this part, as of this writing, is approximately 6 weeks.
Industry Applications for 551002B00000G
Given the technical specifications and features of the 551002B00000G, it could potentially be utilized across multiple high-demand sectors that require efficient thermal regulation. The conceptual applications include:
- Consumer Electronics: Devices such as power amplifiers and voltage regulators in home entertainment systems might use these types of heat sinks to manage the heat produced by internal components, ensuring reliable performance and extending product lifespan.
- Computing and Data Storage: High-performance computing environments, such as servers and data centers, could benefit from the use of heat sinks like the 551002B00000G to prevent thermal runaways in transistor-based power supplies and regulators.
- Telecommunications: Telecom equipment that operates indoor and faces temperature fluctuation could use the 551002B00000G for managing the heat in power modules, thus potentially improving signal integrity and system reliability.
- Industrial Automation: In automated control systems that utilize sensors and transistors extensively, effective heat dissipation is necessary. The low-profile and effective heat transfer characteristics of the 551002B00000G might be advantageously applied here.
- Aerospace and Defense: The rigorous environments faced in aerospace and possibly in defense applications might also leverage the thermal resilience of this heat sink, though this would require specific certification and assurance of suitability under those unique conditions.
It is crucial for engineering and design teams to verify and analyze these conceptual applications to ensure they meet industry standards and specific application requirements.
About Boyd Corporation
Boyd Corporation is a widely recognized leader in thermal management solutions and Heat Sinks. The company excels in developing and manufacturing advanced thermal components that meet rigorous safety and performance criteria. Boyd Corporation’s product range includes a variety of heat sinks and related thermal support devices, all crafted to address the diverse needs across electronics, automotive, and industrial sectors. The 551002B00000G is an exemplar of the company’s commitment to high-quality and robust design, aimed at offering top-tier thermal management solutions in various applications.
Where to Find 551002B00000G by Boyd Corporation
To purchase the 551002B00000G or explore similar products, visit findchips.com. On this platform, you can compare availabilities and pricing from various distributors. Historically, this part has been available at distributors such as Avnet Abacus, TME, RS, Avnet Americas, and Newark, yet the availability and price might vary in real-time, which warrants checking the current status on Findchips. Additionally, for alternative options to the 551002B00000G, you can explore other Heat Sinks that may be offered by Boyd Corporation or other manufacturers.