Overview of 573100D00000G by BOYD Laconia
The 573100D00000G is a heat sink designed specifically for D-Pak and TO-252 packages, offering a thermal resistance of 15 Ω. With an overall height of 10.16 mm, a length of 22.86 mm, and a width of 8 mm, this part is constructed from copper, which is well-known for its excellent thermal conductivity properties. The heat sink features a folded-back fin orientation that enhances its cooling efficiency by increasing surface area without significantly increasing the overall dimensions. The finish is tin plated, ensuring good corrosion resistance while maintaining effective thermal transfer capabilities.
This part is compliant with RoHS standards, indicating it is free from hazardous substances that could impact the environment. It is important to note that the information provided is as of the current writing, and prospective users should verify specifics such as factory lead time, which is listed as approximately six weeks.
Industry Applications for 573100D00000G
The 573100D00000G might find utility across several industries due to its thermal management capabilities. Below are a few potential applications where this component could play a significant role:
- Industrial Automation: In industrial automation systems, devices often require efficient thermal management to ensure reliability. The 573100D00000G might be used in motor drives and controllers that generate heat during operation. By integrating this heat sink, systems might achieve improved performance and longevity.
- Consumer Electronics: Various consumer electronics, including power supply units and audio amplifiers, may generate considerable heat during operation. The usage of the 573100D00000G could potentially help maintain optimal temperatures, thereby enhancing device reliability and reducing the risk of thermal shutdown.
- Telecommunications: Equipment used in telecommunications might also benefit from effective heat dissipation. Power amplifiers and signal processing units could potentially utilize this heat sink to manage thermal load effectively, thereby ensuring stable performance under varying operating conditions.
- Aerospace and Defense: If applicable standards are met, this part could potentially be used in aerospace or defense applications where reliability and performance under high temperatures are critical factors. This may involve avionics systems or communication equipment.
- Automotive (Conditional): Should the 573100D00000G meet industry compliance standards like AEC-Q100, it might be used in automotive electronics, aiding in the management of thermal performance of power components.
It is vital to note that these potential applications are only conceptual and illustrative and require further analysis and verification by engineering and design teams to ensure adherence to industry standards and specific application requirements.
About BOYD Laconia
BOYD Laconia specializes in providing a range of thermal management solutions, particularly focusing on heat sinks as part of the broader category of thermal support devices. The company is recognized for its commitment to quality and compliance, developing parts like the 573100D00000G that meet stringent industry requirements. In addition to this specific part, they offer various similar components that cater to different application needs, ensuring that customers can find an optimal solution for their thermal management challenges.
Research Price and Stock for 573100D00000G by BOYD Laconia on Findchips.com
To explore current pricing and stock levels for the 573100D00000G, it is recommended to visit Findchips. This platform allows users to compare prices and availability from various distributors, making it easier to procure this heat sink.
Historical data indicates that the 573100D00000G has been available at distributors such as New Advantage Corporation, Master Electronics, Sager, and DigiKey. However, potential buyers should verify the current stock status and pricing with these sources on Findchips to get the most accurate information.