576802B00000G by Boyd Corporation

Overview of 576802B00000G by Boyd Corporation

The 576802B00000G by Boyd Corporation, represents a specialized thermal management solution designed for effective heat dissipation in electronic components. It specifically caters to TO-220 and TO-262 packages, which are common in power semiconductors. Featuring an aluminum construction with an anodized finish, this heat sink offers a robust framework for passive heat dissipation.

Fabricated with a U profile and transverse fin orientation, the heat sink integrates a clip mechanism allowing for secure attachment, enabling efficient thermal contact and ease of installation. It exhibits a thermal resistance of 27.3°C/W and dimensions including a length of 14.48 mm, a width of 12.7 mm, and a height of 19.05 mm, which makes it suitable for compact electronic assemblies. The part adheres to relevant environmental and safety standards, as evidenced by its ROHS and REACH compliance.

The Heat Sinks used in this product are critical for preventing thermal overload and ensuring the longevity and reliability of semiconductor devices. Notably, the 576802B00000G is still in an active part lifecycle phase and is classified under EAR99, which broadly allows for exports without license except in special conditions.

Industry Applications for 576802B00000G

The versatility in design and thermal characteristics of the 576802B00000G allows it to potentially serve various high-demand industries. While these potential applications can provide guidance, they should be viewed as a conceptual initiation point and require detailed validation and adaptation by professional engineering and design teams according to specific usage conditions and industry standards.

  • Computing and Data Storage: This device might be implemented to manage heat on voltage regulators or processors within servers, where stable thermal management is crucial. Its compact size and clip-on feature ensure that it can be integrated smoothly into dense PCBs common in modern computing hardware.
  • Consumer Electronics: Devices like amplifiers and power supplies within consumer electronics could utilize the 576802B00000G to dissipate heat efficiently, safeguarding component integrity. The configuration potentially supports the quick-release feature required for consumer device maintenance and upgrades.
  • Telecommunications: In telecommunication equipment, thermal management is critical for reliability. This part could potentially be used in RF amplifiers and power conditioners, which must operate continuously under various environmental conditions.
  • Retail Environments and Security Systems: Power supplies and sensors within these systems require reliable heat management solutions to operate effectively. The small form factor and efficient heat dissipation capacity of 576802B00000G might be effectively utilized in such setups.

Note that these industry applications are speculative based on the device capabilities and do not substitute for necessary technical evaluations and compliance verifications tailored to specific products and markets.

About Boyd Corporation

Boyd Corporation is a leading provider of advanced thermal management solutions inclusive of Heat Sinks. Their product line provides pivotal components for various applications in electronics, telecommunication, automotive, and other high-tech industries. 576802B00000G represents only a fraction of Boyd Corporation’s extensive portfolio, showcasing their commitment to quality and performance in thermal support solutions. Boyd Corporation’s innovation in materials science, design, and adherence to environmental standards helps them stay at the forefront of the industry.

Where to Find 576802B00000G by Boyd Corporation

To procure the 576802B00000G or explore other Heat Sinks, findchips.com provides a comprehensive platform where users can check live stock levels and compare prices from various distributors. Historically, this part has been available through distributors such as Neutron USA, Avnet Asia, Avnet Abacus, TME, RS, Avnet Americas, and Newark. For current availability and pricing, potential buyers should refer to findchips.com for the most up-to-date information.

Compare pricing for 576802B00000G and other Heat Sinks / Thermal Support Devices at findchips.com