Overview of 577002B04000G by Boyd Corporation
The 577002B04000G is crafted from aluminum and possesses an anodized black finish, enhancing its durability and thermal efficiency. This heat sink features a U-profile and transverse fin orientation, specifically designed to provide optimal cooling solutions by increasing the surface area in contact with the air. It measures 13.21 mm in length, 6.35 mm in width, and 19.05 mm in height. The part has been designated with a thermal resistance specification of approximately 32°C/W, making it suitable for managing heat generated by TO-220 package types. Among its notable attributes, the heat sink is both ROHS and REACH compliant, indicating adherence to stringent environmental and safety standards.
Boyd Corporation, the manufacturer of this part, ensures that it remains in active production according to the latest data. This detail is crucial for procurement considerations, particularly for projects requiring long-term availability of parts. The factory lead time for this heat sink, as of this writing, is approximately 6 weeks.
Industry Applications for 577002B04000G
Due to its versatile design and thermal management capabilities, the 577002B04000G could potentially be utilized in a variety of industry applications. Its balance of size, thermal resistance, and construction make it a candidate for several technological implementations.
- Computing and Data Storage: In computing equipment such as servers and desktops, maintaining component temperature is crucial for operational efficiency and longevity. This heat sink might be utilized on voltage regulators or CPU power components where its size and thermal resistance are appropriate for the thermal loads encountered.
- Consumer Electronics: For devices like power amplifiers in home audio systems or in power supply units of gaming consoles, effective heat dissipation is key to reliability and performance. The type and size of this heat sink could possibly fit these applications.
- Telecommunications: Telecom equipment often involves high-density component configurations which generate significant amounts of heat. This heat sink might be used in radio frequency amplifiers or power converters, helping to maintain safe operating temperatures and prevent thermal-related failures.
- Electronic Manufacturing: During the electronic assembly, particularly in the soldering process where components must be kept at regulated temperatures, this heat sink could possibly be used to manage the heat on transient sensitive components.
Please note: The potential industry applications mentioned above are illustrative and require thorough analysis and verification by engineering and design teams to ensure compliance with specific requirements and industry standards.
About Boyd Corporation
Boyd Corporation is renowned in the field of thermal management and thermal support devices, with an extensive catalog that includes a variety of solutions like the 577002B04000G. Known for innovation in material science, Boyd Corporation designs and manufactures products that address thermal challenges across many industries. They produce a wide range of heat sinks with different materials, dimensions, and profiles, ensuring solutions that meet diverse application needs. As Boyd Corporation maintains a continuous growth in technology development, their heat sinks, including the 577002B04000G, often find utility in electronics, telecommunications, and beyond, reflecting their commitment to quality and efficiency in heat dissipation technology.
Where to Find 577002B04000G by Boyd Corporation
To purchase the 577002B04000G, findchips.com is recommended as a reliable source to check real-time stock levels and pricing from various distributors. Historically, this part has been available through distributors such as Avnet Abacus, TME, RS, Avnet Americas, and Newark. However, availability can fluctuate, so it is suggested to use findchips.com to find current listings. Additionally, it’s beneficial to explore the broader category of heat sinks to examine alternative options from Boyd Corporation or other manufacturers.