Overview of 581102B02500G by Boyd Corporation
The 581102B02500G is an extruded Heat Sink fabricated from aluminum and finished with a black anodized coating, ensuring both durability and thermal efficiency. Its design is tailored for use with TO-220 package types, commonly used in various power semiconductor devices. This part features external dimensions of 16.26mm in width and length, with a height of 38.1mm. The heat sink provides a thermal resistance of 16.8°C/W, balancing physical compactness with effective thermal management.
Manufactured by Boyd Corporation, this component aligns with current environmental standards, being both RoHS and REACH compliant. Such compliances not only underscore its usability in diverse markets but also reflect Boyd’s commitment to environmentally sustainable manufacturing practices. The 581102B02500G’s Part Data Attributes indicate that it is still in the active phase of its lifecycle and has a factory lead time of 14 weeks, which is crucial information for procurement planning.
Industry Applications for 581102B02500G
- Computing and Data Storage: This heat sink might be utilized in servers, data centers, or other computing equipment where managing heat effectively is critical. Its capability to handle thermal loads in compact spaces makes it a potential fit for high-performance computing applications.
- Industrial Automation: In automated systems or manufacturing equipment, thermal management becomes crucial especially in control units and high-load electronic circuits. This part might be used owing to its robust construction and effective heat dissipation capabilities.
- Telecommunications: Telecom equipment often requires efficient thermal solutions for reliability especially in compact installations. The 581102B02500G could potentially be used in routers, switches, or networking infrastructure due to its size and thermal performance.
It’s important to note that these potential applications are conceptual and require further evaluation by engineers specific to the demands and standards of each industry. Accurate fit-for-purpose assessments are critical in choosing the right thermal solutions.
About Boyd Corporation
Boyd Corporation is a significant player in the design and manufacturing of thermal management solutions, among other products. Particularly in relation to Heat Sinks, Boyd Corporation specializes in producing a wide array of cooling solutions designed to meet diverse industrial needs. The 581102B02500G is just one example of the innovative products they offer designed for thermal regulation in electronic devices. Their offerings extend beyond this particular model to include a variety of configurations and materials, each intended to provide optimum thermal management in specific applications across electronics, automotive, and other industries.
Where to Find 581102B02500G by Boyd Corporation
To purchase the 581102B02500G, a reliable starting point would be exploring listings on findchips.com. Here, procurement specialists and engineers alike can compare real-time availability and pricing from various distributors. Historically, this part has been available through several distributors such as Avnet Abacus, TME, RS Components, Avnet Americas, and Newark. To find current stock levels and to review competitive pricing, visiting the detailed listing page for the 581102B02500G is recommended. Additionally, buyers can research other Heat Sinks similar to 581102B02500G potentially offered by Boyd Corporation or other manufacturers, ensuring that they find the best component for their specific needs.