7109DG by Boyd Corporation

Overview of 7109DG by Boyd Corporation

The 7109DG is a high-performance heat sink designed for advanced thermal management applications involving D-Pak devices, specifically to TO-263 encased integrated circuits (ICs). Manufactured by Boyd Corporation, this heat sink is constructed from copper with a tin finish, ensuring effective heat dissipation and resistance to oxidation. It is RoHS compliant, indicating that it meets specific international directives on the restriction of hazardous substances.

The 7109DG measures 25.4mm in length, 19.38mm in height, and 11.43mm in width. Its thermal resistance stands at 11 Ω, a measure of its efficiency in thermal conductivity and heat transfer away from the device it cools. The part is active in the market lifecycle and adheres not only to RoHS but also REACH compliance standards. With a factory lead time of six weeks, planning for procurement should accommodate this manufacturing timeframe for order fulfillment purposes.

Industry Applications for 7109DG

The 7109DG could serve multiple industries due to its critical role in managing device temperature, thereby enhancing performance and reliability. Here are selected sectors where the 7109DG might be extremely beneficial:

  • Telecommunications: In sectors where reliable data transmission is crucial, the 7109DG might be used to cool down high-frequency signal transceivers, potentially preventing thermal-induced performance degradation.
  • Computing and Data Storage: Servers and storage devices that process and store large volumes of data generate significant heat. The 7109DG could potentially be utilized to maintain optimal operating temperatures, thus ensuring data integrity and system stability.
  • Consumer Electronics: Used in devices such as gaming consoles and high-performance PCs, the 7109DG could help in dissipating heat generated by powerful processors and GPUs, potentially enhancing durability and performance.
  • Electronic Manufacturing: During the manufacture of electronic devices, especially in soldering and reflow processes, maintaining component temperatures within safe limits is crucial. The 7109DG might be beneficial in such settings to avoid overheating of critical components.

Note that these applications are theoretical and would require specific analysis by engineering and design teams to assess suitability per industry standards and application requirements.

About Boyd Corporation

Boyd Corporation is a widely respected industry leader specializing in Heat Sinks and other Thermal Support Devices. With a focus on innovative thermal management solutions, Boyd has a broad portfolio of thermal products including but not limited to the 7109DG. These products are utilized in various applications to enhance performance and reliability of electronic devices by effectively managing heat. The expertise of Boyd Corporation in manufacturing using materials like copper and advanced designs, such as folded-back fins featured in the 7109DG, underscores their capability to meet diverse industry needs.

Where to Find 7109DG by Boyd Corporation

To purchase the 7109DG, it is recommended to research on findchips.com where you can compare real-time stock levels and pricing from various distributors. Historically, distributors such as Avnet Abacus, RS, and Newark have stocked this part, but availability can vary. Additionally, for those seeking alternatives to the 7109DG, you could explore other Heat Sinks offered by Boyd Corporation or different manufacturers through the same platform.

Compare pricing for 7109DG and other Heat Sinks / Thermal Support Devices at findchips.com