Overview of 573300D00010G by BOYD Laconia
The 573300D00010G by BOYD Laconia is a specialized Heat Sink tailored for electronic applications requiring high levels of thermal management. This heat sink is extruded, featuring a U-profile with a Sn/Ni (Tin/Nickel) finish, thereby adhering to RoHS compliance for environmental safety standards. Its packaging is designed for surface mount technology (SMT) applications, making it suitable for a wide range of compact electronics where space and efficient heat dissipation are critical.
This heat sink is specifically crafted for use with D2PAK devices, characterized by its 10.16 mm height and providing an efficient thermal dissipation solution for high-power surface mount devices. The components’ dimensions, including a length of 26.16 mm and a width of 12.7 mm, play a crucial role in its capability to deliver optimal performance in thermal management. Built for durability and performance, 573300D00010G’s construction and finish not only ensure longevity but also improve thermal conductivity and dissipation.
In terms of manufacturing and availability, 573300D00010G is recognized with a “Transferred” life-cycle code, suggesting its transition from its original manufacture or design phase to a stable production phase. It’s noteworthy that the factory lead time is 6 weeks, meaning that planning and foresight are essential when incorporating this component into production schedules.
Industry Applications for 573300D00010G
The potential applications for the 573300D00010G heat sink span across various fields due to its thermal dissipation efficiency and RoHS compliance. This part could be potentially utilized in additional industries requiring efficient thermal management for electronic components.
- Consumer Electronics: Devices such as gaming consoles, LED TVs, and high-performance computer components could benefit greatly from this heat sink. The high thermal conductivity and compact size make it an ideal choice for dissipating heat in tight spaces where maintaining optimal operating temperatures is crucial for device longevity and performance.
- Telecommunications: In telecom equipment like routers, switches, and base stations, maintaining component temperatures within specifications is vital for reliability and service longevity. The thermal management provided by 573300D00010G could help in preventing overheating in these high-data-rate electronic devices, thereby reducing the risk of failure.
- Industrial Automation: Automation control systems and robotics feature densely packed electronic components that generate significant amounts of heat. The use of a heat sink such as 573300D00010G might provide an efficient way to dissipate heat, ensuring these systems operate within safe temperature ranges and reduce the likelihood of thermal-related downtimes.
- Lighting: High-power LED lighting systems, which are prevalent in both commercial and residential settings, can also benefit from the thermal management solutions offered by 573300D00010G. Effective heat dissipation is essential for preserving the lifespan of LEDs and maintaining light output and efficiency.
Note that these potential applications are conceptual/illustrative and require detailed analysis and verification by engineering and design teams for adherence to industry standards and specific application requirements.
About BOYD Laconia
BOYD Laconia, previously known as Aavid Thermalloy, is a key player in the design and manufacture of Heat Sinks and other thermal management solutions. Their products are renowned for their quality, reliability, and performance in managing heat across a broad spectrum of electronic applications. The 573300D00010G is just one example of their commitment to providing advanced thermal management solutions that meet today’s electronic device requirements.
The company’s expertise in thermal technology is reflected in its wide range of products designed to address the increasing demands for efficient heat dissipation in electronic components and systems. BOYD Laconia’s portfolio includes not only heat sinks but also thermal compounds, insulators, and hardware designed to enhance the performance and reliability of electronic systems across various industries.
Where to Find 573300D00010G by BOYD Laconia
For those looking to procure the 573300D00010G heat sink, findchips.com offers a comprehensive platform to check current stock levels and pricing from various distributors. Historically, this part has been available from distributors such as New Advantage Corporation, Sager, Mouser Electronics, and DigiKey. However, for the most current availability and pricing information, it is recommended to visit findchips.com. The site also provides a valuable resource to explore and compare other Heat Sinks that might be offered by BOYD Laconia or alternative manufacturers, ensuring you find the best thermal solution for your specific application.