Overview of 573300D00010G by Boyd Corporation
The 573300D00010G heat sink manufactured by Boyd Corporation is engineered for efficiency and performance, ideal for dealing with thermal management challenges in various electronic devices. This copper heat sink features an extruded “U” profile and is designed for TO-263 package types. The dimensions are 10.16 mm in height, 12.7 mm in width, and 26.16 mm in length, providing a substantial surface area for heat dissipation. This part offers a thermal resistance of 18°C/W, ensuring substantial effectiveness in cooling applications.
The finish of Sn/Ni (tin/nickel) alongside its compliance with ROHS and REACH standards, showcases Boyd’s commitment to environmental considerations and regulatory compliance. The typical factory lead time for the 573300D00010G is listed as 6 weeks as of the current writing. This heat sink’s design and material choice make it suitable for high thermal conductivity and robustness, crucial for maintaining the integrity and operational stability of electronic components under thermal stress.
Industry Applications for 573300D00010G
- Computing and Data Storage: In server farms and data centers, the 573300D00010G could potentially be utilized for cooling voltage regulators or power modules on server boards. Its effective dissipation capabilities and robust build could help in managing the extensive heat production in these environments.
- Telecommunications: This heat sink might be suitable for radio frequency power amplifiers in base stations and other telecommunications equipment which require stable temperature management to ensure consistent performance and reliability.
- Consumer Electronics: In consumer electronics like high-performance gaming consoles or high-definition media players, this part potentially enhances the efficiency of cooling systems, particularly in compact spaces where efficient heat transfer is crucial.
These potential industry applications are conceptual and require thorough verification by engineering teams to ensure compliance with specific standards and requirements. Additionally, a comprehensive analysis should confirm the part’s suitability for intended applications.
About Boyd Corporation
Boyd Corporation stands out as a significant player in the production of thermal management solutions, specifically in the domain of Heat Sinks. With 573300D00010G as a part of their extensive product lineup, Boyd exemplifies expertise in developing high-performing thermal components critical for modern electronic devices. The company’s dedication to manufacturing high-quality, efficient, and environmentally compliant products is evident in their consistent output.
Boyd’s reputation for craftsmanship in Heat Sinks and Thermal Support Devices is further supported by their continued research and innovation in this sector. Their products, including similar parts to 573300D00010G, are integral to electronics that require reliable thermal management solutions across various industries, from consumer electronics to industrial applications.
Where to Find 573300D00010G by Boyd Corporation
To purchase the 573300D00010G heat sink, it is recommended to check availability and current pricing on findchips.com. The part has historically been available through distributors such as Avnet Abacus, TME, Verical, RS, Avnet Americas, and Newark. However, to obtain updated stock levels and potentially better pricing options, visiting the FindChips platform will provide the most current details.
Additionally, for those looking for alternatives or related parts from either Boyd Corporation or other manufacturers, the Heat Sinks page on findchips.com presents a comprehensive catalog that could be useful in finding suitable matches.