Overview of 573100D00010G by Boyd Corporation
The 573100D00010G is a high-performance heat sink designed and manufactured by Boyd Corporation. This component is specifically tailored for efficient thermal management in electronic devices, featuring a thermal resistance of 15°C/W. It is constructed from copper, known for its excellent thermal conductivity, and finished with matte tin which provides corrosion resistance and enhances solderability. The heat sink has a unique ‘U’ profile and longitudinal fins that increase the surface area, thus facilitating better heat dissipation.
Dimensionally, the 573100D00010G measures 22.86mm in length, 10.01mm in height, and 8mm in width, making it suitable for compact applications. It is designed to cool TO-252 package types, commonly used in voltage regulators, MOSFETS, and low-power ICs. Complying with RoHS standards, this heat sink assures environmental sustainability by avoiding hazardous substances in its construction.
As of the current writing, the factory lead time for this part is approximately 6 weeks, which indicates the time required from order placement to delivery.
Industry Applications for 573100D00010G
- Computing and Data Storage: Devices such as voltage regulators and power transistors in computing hardware might potentially benefit from the thermal management capabilities of the 573100D00010G. Its copper construction and efficient design could possibly aid in maintaining optimal operating temperatures, thus enhancing performance and reliability.
- Consumer Electronics: In consumer electronics where space and efficiency are crucial, such as in gaming consoles and laptops, the compact and efficient design of this heat sink might be beneficial. The RoHS compliance of the 573100D00010G also supports the environmental standards often required in this industry.
- Telecommunications: Telecom equipment, which requires constant operation and faces thermal management challenges, could potentially utilize such a heat sink. The properties of the 573100D00010G might help in dissipating heat effectively from power amplifiers and RF transistors, ensuring continuous service and longer life spans.
- Electronic Manufacturing: During the manufacturing of printed circuit boards (PCBs) and other electronic assemblies, heat sinks like the 573100D00010G are crucial for managing the heat generated by components. Its usage might ensure higher reliability and performance of the manufactured electronic products.
Note that these potential industry applications are conceptual/illustrative and require analysis and verification by engineering and design teams for adherence to industry standards and specific application requirements.
About Boyd Corporation
Boyd Corporation is recognized in the industry for its expertise in the development and manufacturing of heat sinks and other thermal support devices. With a focus on innovation and quality, Boyd Corporation offers a variety of thermal solutions designed to meet the demanding requirements of modern electronic devices. The 573100D00010G is one example of their high-quality products, designed to offer efficient thermal management solutions. Boyd’s products are typically aimed at enhancing performance and reliability across multiple industries by addressing the thermal challenges faced by electronic components.
Where to Find 573100D00010G by Boyd Corporation
To purchase the 573100D00010G, it is advisable to research on findchips.com. This platform provides detailed information about availability, pricing, and distributors. Historically, distributors such as Avnet Asia, Avnet Abacus, TME, Avnet Americas, and Newark have stocked this part. However, for the most current stock levels and pricing, please visit findchips.com. You can also find alternative heat sinks that might be offered by Boyd Corporation or other manufacturers through the same platform.