Overview of 576802B03100G by Boyd Corporation
The part designated as 576802B03100G is a clip-type, aluminum heat sink with an anodized finish. It is specifically designed for passive cooling of TO-220 and TO-262 package types, featuring a horizontal orientation. This heat sink has a thermal resistance of 27.3°C/W, making it suitable for moderate heat dissipation requirements. The dimensions of this product are 19.05 mm in length, 14.48 mm in width, and 12.7 mm in height, furnished in a striking black color that aids in its aesthetic integration into various electronic assemblies.
Manufactured by Boyd Corporation, a leader in thermal management solutions, this heat sink aligns with current environmental compliance standards such as RoHS and REACH. The part is defined under the EAR99 category of the Export Control Classification Number (ECCN), which generally allows for it to be exported without a specific license. The noted factory lead time is 6 weeks as of the current writing.
Industry Applications for 576802B03100G
The use of this part could potentially span multiple industries, primarily driven by its capability to manage heat in electronic components efficiently. Here are several industries where the 576802B03100G might find utility:
- Consumer Electronics: Devices like power regulators, audio amplifiers, and LED drivers could potentially use this heat sink to manage thermal loads effectively. Its compact design allows for use in spaces where footprint is a significant consideration.
- Computing and Data Storage: Server power supplies and processors that utilize the TO-220/TO-262 form factor may benefit from the thermal regulation benefits provided by this heat sink. The use of a clip construction simplifies the assembly process, which is crucial in manufacturing environments.
- Telecommunications: In power management applications within telecommunication systems, managing heat is critical for reliability and functionality. The 576802B03100G could be evaluated for its potential effectiveness in power conditioners and RF amplifiers.
- Industrial Automation: In the field of automation where reliability and longevity of electronic components are paramount, effective heat dissipation is essential. Equipment such as motor drives and controllers using TO-220/TO-262 packaged semiconductors might leverage this heat sink for better thermal management.
- Electronic Manufacturing: During the assembly processes where quick and extensive testing of semiconductor devices is required, this heat sink could be employed to maintain operational temperatures, ensuring that component testing reflects the real-life thermal scenarios they will endure.
It is crucial to note that these potential industry applications are conceptual and would require rigorous analysis and verification by engineering and design teams to ensure the 576802B03100G meets specific application requirements and adheres to industry standards.
About Boyd Corporation
Boyd Corporation stands as a significant player in the industry, specializing in advanced material sciences and engineering innovations with a particular focus on thermal management solutions. Their portfolio includes a variety of thermal support products, ranging from simple heat sinks to complex liquid cooling systems. Boyd is known for their commitment to delivering high-performance, reliable solutions across various sectors, incorporating both active and passive cooling techniques.
The inclusion of the 576802B03100G into their portfolio highlights their competence in manufacturing scalable and efficient Heat Sinks. This particular product, with its meticulously engineered properties, is tailored to meet the stringent thermal and mechanical demands in modern electronic devices, upholding the reputation as a corporation that exceeds typical standards.
Where to Find 576802B03100G by Boyd Corporation
If you are considering incorporating 576802B03100G in your designs or product lines, a convenient place to start your procurement process is by exploring findchips.com. On this platform, you can constantly updated stock levels, pricing, and other crucial commercial information. Historically, this part has been available through distributors like TME and Avnet Americas. However, to obtain the most current availability and competitive pricing, visiting findchips.com is recommended. Additionally, for finding alternatives to 576802B03100G or exploring other products within the Heat Sinks category offered by Boyd Corporation or other manufacturers, the same portal offers comprehensive resources.