Overview of 530002B02500G by Boyd Corporation
The 530002B02500G is an extruded aluminum Heat Sink designed by Boyd Corporation. With dimensions measuring a width of 41.9 mm, a height of 63.5 mm, and a length of 25.4 mm, this Heat Sink is specifically anodized to enhance thermal performance and corrosion resistance. Its thermal resistance is rated at 2.6°C/W, which makes it suitable for packages cooled to the To-220 standard. Additionally, this Heat Sink features a radial fin orientation which aids in dissipating heat more efficiently away from the device, typically used on transistors. Importantly, the 530002B02500G is compliant with RoHS regulations, ensuring that it meets current environmental standards with regards to hazardous materials.
The part is currently active in its life cycle, affirming ongoing manufacturing and availability. According to the latest information, the factory lead time for this part is 14 weeks, though this is subject to change based on production schedules and demand.
Industry Applications for 530002B02500G
The 530002B02500G’s design and specifications render it apt for various applications within the Electronics and Industrial Automation sectors. Here are some potential use cases in these industries:
- Industrial Automation: This Heat Sink might potentially be used in managing thermal loads in automated manufacturing equipment where high power transistors are common. The robust construction and considerable thermal resistance could feasibly support the longevity and reliability of such equipment under continuous operational stresses.
- Electronic Manufacturing: In electronic manufacturing, especially in power electronics and devices requiring voltage regulation such as voltage regulators and power supplies, this Heat Sink could play a crucial role. Its ability to efficiently dissipate heat potentially helps in maintaining optimal operating temperatures, thus ensuring device stability and performance.
It is crucial to note that these potential industry applications are illustrative and require thorough validation by engineering and design teams to ensure compliance with specific industry standards and application requirements.
About Boyd Corporation
Boyd Corporation is a prominent manufacturer in the thermal management and environmental sealing solutions industry, offering a variety of products including Heat Sinks within the broader category of Thermal Support Devices. Known for their innovative approach in product development and sustainability, Boyd Corporation produces a range of solutions that include but are not limited to the discussed 530002B02500G. Their products are engineered to address the needs across a vast array of high-performance applications, ensuring both effectiveness and compliance with international standards.
Where to Find 530002B02500G by Boyd Corporation
For potential buyers or engineers looking for specific details on sourcing the 530002B02500G, findchips.com offers a detailed listing. Here, one can also explore comparison shopping for Heat Sinks from various manufacturers, including alternatives that might either match or exceed requirements set by Boyd Corporation’s offerings. Previously, the 530002B02500G has been available from distributors such as Avnet Abacus, TME, RS, Avnet Americas, and Newark. To confirm current availability and pricing, it is recommended to visit findchips.com.