504102B00000G by Boyd Corporation

Overview of 504102B00000G by Boyd Corporation

The 504102B00000G is a heat sink designed to manage heat dissipation effectively. It features a thermal resistance of 15.6°C/W, which indicates its efficiency in transferring heat away from electronic components. The construction of this heat sink follows a U profile with longitudinal fins. Made from aluminum, it is both lightweight and a good thermal conductor, making it suitable for high-performance applications. Additionally, it is anodized to enhance its corrosion resistance and aesthetic quality, while also complying with RoHS regulations.

With dimensions of 19.8 mm in width, 17.81 mm in height, and 21.6 mm in length, this heat sink is tailored for TO-220 package devices. Its black color adds to the visual appeal while providing some additional heat absorption properties, facilitating better thermal management. As of the current writing, the factory lead time for this part is approximately 6 weeks, making it important for procurement teams to consider this timeframe when planning their projects.

Industry Applications for 504102B00000G

The 504102B00000G heat sink may find utility across various sectors, particularly where efficient thermal management is crucial. Below are some potential industries where this part might be applicable:

• Consumer Electronics: In devices such as audio amplifiers or power supplies, the 504102B00000G could possibly be employed to dissipate heat generated by semiconductors. Its dimensions and thermal characteristics could make it suitable for maintaining operational efficiency in compact electronic designs.
• Telecommunications: The heat sink may be used in telecommunications equipment, particularly in high-power RF amplifiers. The efficient thermal resistance of 15.6°C/W could potentially help maintain the reliability of signals and prevent overheating in critical communication devices.
• Industrial Automation: In automated systems and robotics, this heat sink might be utilized for regulating the temperature of control modules or power electronics. Its robust aluminum construction and RoHS compliance could meet the stringent requirements set for industrial applications.
• Automotive Electronics: Assuming relevant automotive standards apply, the heat sink could potentially be integrated into power control units or battery management systems, where heat management is essential for system reliability and performance.
• Medical Imaging: The adaptability of the 504102B00000G might allow it to be used in medical imaging equipment like MRI machines or ultrasound devices, where maintaining proper thermal conditions is critical for accurate imaging and patient safety.

These potential industry applications are illustrative and require careful analysis and verification by engineering and design teams to ensure adherence to specific application requirements and industry standards.

About Boyd Corporation

Boyd Corporation specializes in Thermal Support Devices, particularly in the development and manufacturing of heat sinks such as the 504102B00000G. The company focuses on creating solutions that effectively manage heat in various electronic devices. Boyd’s heat sinks are characterized by innovative designs and compliance with environmental regulations, ensuring that their products support sustainable practices. The 504102B00000G, along with similar parts, reflects Boyd’s commitment to quality and performance in the thermal management sector, allowing customers to achieve efficient cooling solutions for their applications.

Where to Find 504102B00000G by Boyd Corporation