Overview of 504222B00000G by Boyd Corporation
The 504222B00000G is a heat sink designed for efficient thermal management in electronic applications. It is characterized by a thermal resistance of 6.4 °C/W, making it suitable for various semiconductor devices requiring heat dissipation. The part is constructed from aluminum, ensuring good thermal conductivity and durability. Its anodized finish not only enhances the aesthetic appearance but also provides additional protection against corrosion.
This heat sink features a U-profile design with longitudinal fins that facilitate increased surface area for heat exchange, thus enhancing performance. The dimensions of this component are as follows: 21.59 mm in height, 19.81 mm in width, and 36.83 mm in length. As a passive cooling solution, it is designed to be mounted via a screw, often used with TO-220 packages, making it a common choice in electronic circuit boards.
Manufactured by Boyd Corporation, this component adheres to RoHS compliance, indicating that it meets environmental standards for hazardous substances. As of the current writing, the part is classified as active in its life cycle, suggesting continued availability and support from the manufacturer.
Industry Applications for 504222B00000G
The 504222B00000G heat sink might find its applications across a variety of industries. Below are some potential use cases where this component could be integrated:
- Consumer Electronics: In devices such as audio amplifiers or gaming consoles, the heat sink could be used to maintain optimal operating temperatures for power components. Its efficient thermal resistance would support reliability and performance in high-power scenarios.
- Telecommunications: The heat sink might be utilized in networking equipment like routers and switches, where managing heat generated by high-speed processors is vital. The anodized aluminum construction could provide resistance to environmental factors in data centers.
- Aerospace and Defense: While specific military applications were not mentioned, components similar to the 504222B00000G could be employed in satellite systems, ensuring thermal regulation in harsh environments.
- Computing and Data Storage: Servers and high-performance computers may utilize this heat sink to dissipate heat from CPUs or GPUs, enhancing system reliability and preventing thermal throttling during intensive computational tasks.
- Industrial Automation: In control systems and motor drives, the heat sink could serve to manage heat buildup in power electronics, contributing to system longevity and stable operation.
It is important to note that these potential industry applications are only conceptual and illustrative. Engineering and design teams should conduct thorough analyses to ensure compliance with industry standards and specific application requirements.
About Boyd Corporation
Boyd Corporation is a manufacturer known for its range of thermal management solutions, including heat sinks within the broader category of thermal support devices. With a focus on innovative designs and reliable materials, they provide numerous products that meet different thermal management needs across various applications.
The 504222B00000G is one of the many heat sinks they offer, which exemplifies the company’s commitment to quality and compliance with environmental regulations. Boyd also manufactures similar heat sink components that might share design characteristics and thermal performance attributes, ensuring versatility in application.
Where to Find 504222B00000G by Boyd Corporation
This part has historically been available at distributors including Neutron USA, Avnet Abacus, TME, and Verical, among others. Availability may vary, and readers are encouraged to verify current stock and pricing through findchips.com.