593002B03400G by Boyd Corporation

Overview of 593002B03400G by Boyd Corporation

The 593002B03400G is a heat sink designed to provide thermal management for electronic components, particularly for TO-220 packages. Constructed from aluminum and finished with an anodized black coating, this heat sink integrates a fin design to enhance the surface area, thereby improving heat dissipation. The thermal resistance rating is 13.4°C/W, which indicates the efficiency at which it can transfer heat away from semiconductors, important for maintaining optimal operating temperatures in electronic devices.

Manufactured by Boyd Corporation, this heat sink adheres to ROHS compliance standards, ensuring that it is free from hazardous substances, which is a consideration for many engineers when selecting electronic components. With dimensions of 23.93 mm in width, 30 mm in height, and 12.7 mm in length, the compact design of the 593002B03400G makes it suitable for applications where space may be limited.

This heat sink is currently active in the market, with an expected factory lead time of approximately six weeks, as of this writing. It also has a body material characteristic of aluminum, contributing to its lightweight and efficient nature.

Industry Applications for 593002B03400G

Given its thermal performance characteristics and construction, the 593002B03400G might find applications across various industries. Below are some potential use cases where this heat sink could be considered:

  • Consumer Electronics: In consumer electronics, the heat sink could potentially be used in devices such as smartphones, tablets, and laptops, where managing heat is crucial for device longevity and performance. The 13.4°C/W thermal resistance rating could support the operation of power transistors or voltage regulators.
  • Aerospace and Defense: The aerospace sector might possibly utilize the 593002B03400G in avionics systems where cooling is necessary for reliable operation in harsh environmental conditions. The anodized aluminum finish may also provide additional protection against corrosion.
  • Telecommunications: In telecommunications equipment, the heat sink might be integrated into devices such as base stations or routers that require efficient heat management for their power amplifiers and other high heat-generating components. The compact design can be advantageous in densely populated server racks.
  • Robotics and Drones: In robotics, the 593002B03400G could potentially be employed to cool motors and control electronics where size and weight are critical factors, while still maintaining performance stability through effective thermal management.
  • Automotive Electronics: If automotive standards such as AEC-Q100 or AEC-Q101 compliance are necessary, this heat sink could be applied within electric vehicle (EV) battery management systems or power electronics, where heat dissipation is especially crucial for reliability and efficiency.

These potential industry applications are only conceptual and illustrative. They require thorough analysis and verification by engineering and design teams to ensure adherence to industry standards and specific application requirements.

About Boyd Corporation

Boyd Corporation specializes in thermal management solutions, particularly focusing on heat sinks among its array of thermal support devices. The company has a strong background in developing products that offer efficient thermal management across various industries. The 593002B03400G is one such product in their portfolio, designed specifically for applications where space and thermal efficiency are of paramount importance. Boyd Corporation produces various similar parts that cater to diverse thermal management needs, allowing engineers ample options when selecting components for specific applications.

Where to Find 593002B03400G by Boyd Corporation

For those interested in procuring the 593002B03400G, it is advisable to research purchasing options through findchips.com. This site provides valuable information on stock levels and pricing from various distributors. Historically, the part has been available from distributors such as Neutron USA, Avnet Abacus, TME, Verical, Future Electronics, RS, Avnet Americas, and Newark, but it is vital to check on the current availability as stock may fluctuate.

Compare pricing for 593002B03400G and other Heat Sinks / Thermal Support Devices at findchips.com